Air temperature sensor connection assembly

ABSTRACT

A fast response fluid temperature sensor is disclosed which consists of a silicon temperature sensing semiconductor chip mounted on an extremely thin fin having a high surface area to mass ratio. The fin and chip combination are mounted in a frame assembly, with the thermal conductivity of the frame assembly being high and the specific heat being low for maximum heat transfer from the fluid being sensed to the silicon chip. The chip and fin assembly are illustrated as being open to the free flow of fluid around the assembly, no insulating material being provided between the fluid media being sensed and the fin and chip assembly, and a protective cage is formed around the fin and chip assembly. Suitable connection is made between one electrical terminal of the chip and the fin and between the other electrical terminal of the chip and the external circuitry, with various modified forms of such connections being illustrated.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to a fluid temperature sensor and morespecifically to a fluid temperature sensor of the semiconductor typehaving a high surface area to mass ratio for the temperature sensingassembly thereby providing an extremely fast acting temperature sensingunit. This invention is a modification of inventions disclosed incopending application Ser. Nos. 857,558 and 857,559, filed Dec. 5, 1977and commonly assigned.

2. Description of the Prior Art

As described above, the present invention relates to a temperaturesensor which will provide a fast response device suitable for use incontrol systems where a rapid temperature sensing of a flowing fluidmedia is required. A typical use of such a temperature sensor would bein conjunction with the air induction system in an automotive enginewherein the air temperature is utilized in conjunction with other engineparameters for controlling the fuel in a fuel management system.

There are devices presently on the market which are similar to thatwhich is to be described, but do not provide the extremely fasttemperature response associated with the sensor of the presentinvention. In the temperature sensors presently being manufactured, forexample by the Texas Instruments Corporation, the temperature sensingelement is a silicon chip semiconductor which is doped by variousimpurities to control the resistance of the chip in response tovariations in temperature. The silicon semiconductor chips are sized asblocks of approximately 0.015 × 0.015 × 0.006 inch dimension, the blocksbeing bonded to a metal plate on one side and a gold wire attached tothe opposite side of the chip in typical semiconductor manufacturingfashion. The chip is then bonded to a metallic frame which is used asthe base of the device, which frame is approximately 500 times the massof the silicon chip. The entire assembly is then encased in a plasticmolding for handling and installation strength.

The metallic frame utilized as the base of the device is of a thickcross-sectional area and relatively short in length thereby providing alow surface area to mass ratio. Further, the plastic incapsulant whichhas been made a structural part of the device has a low thermalconductivity compared to metal and thus impedes the flow of heat to orfrom the silicon chip. This incapsulant has been utilized due to thestructural design of the assembly.

SUMMARY OF THE INVENTION

It has been found that the dynamic performance of a semiconductor typetemperature sensor can be maximized if the mass of the semiconductorchip utilized in conjunction with sensors of this type is minimized andis bonded to a metallic fin having a large area relative to the mass ofthe fin and semiconductor chip assembly. In a preferred embodiment, theconnection to one terminal of the semiconductor chip is achieved byconductively bonding the chip to the metallic fin and providing a secondlead to the edge of the fin by various techniques to be described inconjunction with the description of FIGS. 12-17.

The metallic fin should be arranged so that the fluid flow of the fluidbeing sensed is parallel to the fin or in maximum heat transfertherewith. As will be shown, the temperature response of a thin,constant thickness metallic fin emersed in a fluid is primarily afunction of the surface area to mass ratio of the fin. Thus, for a givenmaterial and independent of the size of the fin, the temperatureresponse time constant approaches zero as the thickness of the finapproaches zero in a theoretical assembly.

For a practical assembly, the density and specific heat also affect thetime constant and both parameters have been found to minimize theresponse time when these parameters are minimized. Additionally, whenthe silicon chip is added to the fin, the heat transfer between the finand silicon chip becomes important. The thermal contact material betweenthe fin and chip must be of a high conductivity type, as for examplegold. Additionally, the heat flow from the surrounding areas of the finrelative to the area covered by the semiconductor chip must bemaximized. Accordingly, the thermal conductivity of the fin becomesimportant and any material with high heat conductivity (such asaluminum) is desirable.

In the preferred embodiment of the invention the fin is fabricated as acircular, thin metallic disc with a semiconductor chip mounted centrallyof the edges of the disc. Theoretically, the fin should be fabricated ofa tapering cross-section, the thickest portion of the cross-sectionbeing in the area wherein the semiconductor chip is mounted, the fintapering to zero thickness at the periphery. In the practical embodimentof the invention, the fin is supported at the periphery by various meansand the semiconductor chip is electrically bonded on the surface of thechip but not in contact therewith.

It has been found that the assembly which supports the fin must be suchthat heat flow to or from the support is minimized since this heat doesnot necessarily result from the temperature of the fluid underconsideration and, therefore, the dynamic performance and the steadystate temperature of the semiconductor chip maybe affected. Statedotherwise, a difference in temperature between the chip and the fluidmedia represents an error in the output signal and it is this errorwhich should be minimized for any given instantaneous period of time. Itis the desiratum of this invention to minimize the transient time toachieve stability between the temperature of the chip and thetemperature of the fluid under consideration.

As stated above, one possible source of error in this signal resultsfrom heat flow to or from the fin support. Therefore, the fin supportshould be located at a point as remote as possible from thesemiconductor chip and in the preferred embodiment this support isestablished at the outer edge of the chip. Therefore, this necessity fora mechanical attachment prevents the outer edge of the chip from being atheoretical ideal zero thickness. It has been found that if the fin isof sufficient size in area, the radial flow of heat from the inner toouter or outer to inner portion of the chip is essentially zero, andthus the heat flow due to the mechanical support of the fin isminimized.

In a preferred embodiment of the invention, the other terminal, otherthan the fin terminal, connected to the chip is formed by providing athin stripe of insulating material from the outer edge of the finradially inwardly to the semiconductor chip, up the side of thesemiconductor chip and slightly overlapping the top surface thereof. Thelead wire, ribbon or conducting film is then fabricated to conform tothe surface of the insulating stripe and extended on the top surface ofthe chip beyond the insulating stripe. Finally, a second thin coat ofinsulating material is applied to the lead to encase the lead from itsend adjacent the bare upper surface of the semiconductor chip across thefin to the outer edge of the fin.

The insulating material may be any plastic adhesive which satisfies theadhesive requirements of the fin and has an electrical resistance whenin place for at least two orders of magnitude greater than theresistance of the semiconductor chip and is tolerant of the temperatureand the environmental conditions of the finished temperature sensor. Atypical material for automotive applications is the cyanoacrylate classof adhesives such as marketed by the Eastman Corporation as adhesive910THT.

Since the lead wire and adhesive material described above representadditional undesirable mass, the adhesive insulating stripe should be ofminimal thickness and the wire should be of minimal size to minimize theeffect of this additional mass on the dynamic and steady stateperformance of the sensor assembly.

In selecting suitable fin material the following relationship isconsidered to be of significance in investigating the variouscharacteristics of a material for its merit in conjunction with use inconnection with the present invention. For maximum theoreticalperformance, the following relationship exists.

    M.sub.t = [K/(ρ) (Sp.Hp.)]

where

K = thermal conductivity,

ρ = density, and

SP.HP. = specific heat

The most desirable material is that which has properties maximizing theterm M_(t). In a practical application, other properties such as costfabricability, environmental tolerance and availability may modify thematerial selection. In a modified form of the invention it has beenfound that the heat transfer from the fin to the chip maybe maximizedand the apparent mass of the assembly minimized by contacting both sidesof the chip with an individual fin. Thus, each fin becomes one of theelectrical connections to the chip and the transfer of heat to and fromthe fin, and thus the semiconductor chip, is made most efficient. It isapparent that the fin must be spaced a sufficient distance to preventinterference of the flow of the fluid under consideration between thefins, which interference would lower the heat transfer between the finsand the fluid. As a modified form of the invention, it has been foundthat the fins could be fabricated of approximately a conical or discshape with the apex of each disc electrically connected to the oppositesides of the semiconductor chip. With both fins attached to a supportstructure, as particularly illustrated in FIG. 11, a very stiffmechanical structure is obtainable.

Electrical connection to the fin or plural fins maybe accomplished byproviding electrically conducting supports for the fin or for theconductors in nonconducting supports. The attachment of the leads to theouter peripher maybe made by any suitable method such as soldering,welding, conductive adhesives, or by simple mechanical contact. Analternate lead and support approach may be to provide integral supportarms on the basic fin stamping which maybe bent to suitable shape toprovide support and convenient electrical connection to the temperaturesensing body.

As is readily apparent, the fin or plurality of fins maybe formed by diestamping methods and suitable radial or circumferntial ridges maybeprovided in the fins to enhance structural ridigity. These fins mayadditionally perform the function of promoting boundary layer turbulencefor better heat transfer between the fluid under consideration and thefin and may also be utilized to provide a protective trough for leadwires and insulation.

Accordingly, it is one object of the present invention to provide animproved fluid temperature sensing device.

It is another object of the present invention to provide improvedtemperature sensing device for a fluid having extremely fast dynamic andsteady state performance.

It is a further object of the present invention to provide an improvedfluid temperature sensing device having a high surface area to massratio to enhance the transfer of heat from a heat transfer device to theactual temperature sensing element.

It is another object of the present invention to provide an improvedfluid temperature sensing device which responds faster than previousknown temperature sensing devices by an order of magnitude.

It is still another object of the present invention to provide animproved mounting assembly for a temperature sensing device whichenhances the response time and steady state performance of thetemperature sensor assembly.

It is a further object of the present invention to provide improved leadconnection techniques for temperature sensing assemblies incorporatingassembly conductor chips for the sensing element.

It is still another object of the present invention to provide animproved temperature sensing assembly utilizing a semiconductor chipwhich enhances the transfer of heat from the fluid whose temperature isbeing considered to the semiconductor chip.

It is another object of the present invention to provide an improvedfluid temperature sensing assembly which is inexpensive to manufacture,reliable in operation and easily installed.

Further objects, features and advantages of the present invention willbecome more readily apparent upon a consideration of the followingspecification when taken in conjunction with the attached drawings, inwhich:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a side view of a preferred form of the fast response airtemperature sensor incorporating certain features of the presentinvention;

FIG. 2 is a top view of the air temperature sensor of FIG. 1 andparticularly illustrating the positioning of the semiconductor chip andthe interconnections between the output leads and the semiconductor chipand fin;

FIG. 3 is a cross-sectional view of the air temperature sensor of FIG. 2taken along line 3--3 thereof;

FIG. 4 is a cross-sectional view of the interconnection between theoutput conductor and the semiconductor chip of FIG. 2 taken along line4--4 thereof;

FIG. 5 is a top view of a modified form of the fast response temperaturesensor of FIG. 1;

FIG. 6 is a partial cross-sectional view of the modified air temperaturesensor of FIG. 5 taken along line 6--6 thereof and particularlyillustrating a modified position for the semiconductor chip and theinterconnection with the output conductor;

FIG. 7 is a cross-sectional view similar to FIG. 4 and particularlyillustrating the interconnection between the output conductor and thefin, the cross-sectional view taken along line 7--7 of FIG. 5;

FIG. 8 is a top view of another modified form of the fast response airtemperature sensor of the present invention, partially broken away;

FIG. 9 is a cross-sectional view of the modified air temperature sensorof FIG. 8 taken along line 9--9 thereof;

FIG. 10 is another cross-sectional view of the modified air temperaturesensor of FIG. 8 taken along line 10--10 thereof;

FIG. 11 is a further modified air temperature sensor utilizing certainother features of the present invention, this figure being shownpartially in section to illustrate the interconnection between the dualfins and the support members;

FIG. 12 is a cross-sectional view of a further modification of the airtemperature sensor of the present invention and particularlyillustrating another type of interconnection between the outputconductors and the fin and semiconductor chip;

FIG. 13 is a cross-sectional view of another modified form of thepresent invention and particularly illustrating a modification of theinterconnections between the output conductors and the fin andsemiconductor chip;

FIG. 14 is a bottom view of the semiconductor chip, thin andinterconnection assembly of FIG. 13 taken along line 14--14 thereof;

FIG. 15 is an illustration of a further modification of a method forproviding connections from the output conductor to the semiconductorchip;

FIG. 16 is a perspective view of a modified form of semiconductor chipin which the output terminals for the semiconductor chip are provided ona single face thereof;

FIG. 17 is a plan view, partially broken away, of a method of mountingthe semiconductor chip of FIG. 16 on a fin and particularly illustratingthe connections between the semiconductor chip and the fin and outputconductor; and

FIG. 18 is a modified form of the invention wherein the temperatureresponsive element is attached by thick or thin film techniques.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawings, and particularly FIG. 1 thereof, there isillustrated a side view of a preferred form of temperature sensor 20incorporating the features of the present invention. The sensor 20includes three portions, a connector 22, the sensor assembly 24 and apair of interconnecting wires 26 which provide a connection between thesensor 24 and the connector 22. The connector 22 is of the typetypically utilized in the automotive industry which includes a housing28, within which are formed the plug and socket members utilized to matewith the corresponding socket and plug members, respectively, in thewiring harness of the automobile. Suitable interlocking means 30 isprovided to lock the housing 28 to the corresponding member in thewiring harness to preclude the two members from being unintentionallydisassembled.

The temperature sensor assembly includes a brass or other suitable metalfitting 34 which is adapted to be threaded into an aperture in theintake manifold of an automobile and suitably tightened by means of ahexagonal head portion 36 as is common in the automotive art. Thetemperature sensor assembly 24 further includes a molded element 38which is adapted to mount a fin 40 at one end thereof and rigidly fixthe fin 40 relative to the brass fitting 34 as we will fully explainhereinafter. The conductors 26 are molded within the interior of theplastic element 38 and, as will be seen hereinafter, the conductors areled up through the center of a pair of mounting arms 42, 44. The entireassembly including arms 42, 44 and the fin 40 are protected by a wirecage 46 which include a pair of formed domed wires which are welded attheir apex and the opposite ends thereof are inserted into aperturesformed in the brass fitting 34 and soldered into place. Thus, thetemperature sensing fin 40, and the semiconductor chip to be describedhereinafter, are protected from foreign elements which may be injuriousto the fin and semiconductor chip should these latter elements be struckby the foreign elements.

Referring now to FIG. 2, which is a top view of the temperature sensorassembly 24 of FIG. 1, there is illustrated the particular referredmethod of mounting the semiconductor chip on the fin 40 and also themethod in which the connections are made to the conductors 26 from thefin 40 and a semiconductor chip 48. Specifically, the fin 40 has mountedthereon a nonconducting ceramic chip 50 by any suitable method describedabove, for example by conductive adhesive, etc. As is seen from FIG. 2,the chip 50 is mounted a slight distance away from the mounting arm 44to permit a conductor 52 centered in the mounting arm 44 to be led upthrough an aperture formed in the fin 40. The conductor 52 is thenlapped over the top of the fin 40 and attached to the nonconducting chip50 as will be more fully explained in conjunction with the descriptionof FIG. 4 a conductor 53, in the form of a gold wire, connects theconductor 52 with the semiconductor chip 48. Similarly, a conductor 54which is molded into the center of mounting arm 42 is led up through asecond aperture formed in the fin 40 and folded over into engagementwith the top surface of the fin 40. The conductor 54 is then suitablyattached to fin 40 by soldering or conductive adhesives.

FIG. 3 illustrates various features of the assembly not illustrated ingreat detail in FIGS. 1 and 2. For example, the conductors 26 are moldedwithn the member 38 and suitable connectors 58, 60 are provided toconnect the interconductors of conductors 26 to the conductors 52, 54.As is seen from FIG. 3, the conductors 54 are molded within the mountingarms 44, 42 respectively and folded over at the tops thereof to form theconnections described in conjunction with FIG. 2. The material formingsupport elements 42, 44 is of the thermal plastic type whereby heat isapplied to the upper ends of the members 42, 44 and the upper ends aremelted over to form a firm attachment to the fin 40. As is seen from theleft end of the drawing, the bottom of brass fastener 24 is swaged overat 62 to firmly hold the molded member 38 within the brass element 36.

Referring to FIG. 4, there is illustrated one method of interconnectingthe conductor 52 with the semiconductor chip 48. Also illustrated is theheated portion of the upper end of mounting arm 44 which is melted toform the attachment between arm 44 and the fin 40.

As is seen from FIG. 4, the conductor 52 is led through an aperture 64formed in the fin 40 and folded over to form a loop and a flat portion66, flat portion being contiguous with the upper surface of the chip 50.The portion 66 is then suitably attached to the nonconducting chip 50 byany suitable method, as for example, by using a conductive adhesiveforming a mechanical bond and electrical contact between conductor 66and chip 50. As will be seen from the description of FIGS. 12 to 17,other methods of attaching the conductors may be utilized or keepingwithin the spirit of the invention.

Referring now to FIG. 5, there is illustrated a modified form of the airtemperature sensor of the present invention which includes substantiallythe same base element described above bearing reference numerals 34 and36 and the same protective cage wires 46. The modified form as bestillustrated in FIG. 6, includes a plastic element 70, into which ismolded into the conductors 26, the connectors 58, 60 and a pair ofconductors 72, 74. The conductors 74 is led up through a mounting arm 76integrally formed as a part of the plastic member 70 and folded over forattachment to a fin element 78 as will be more fully described inconjunction with the description of FIG. 7.

As is seen from FIG. 6, the fin 78 is formed with a dished portion 80into which is placed a semiconductor chip 82. The semiconductor chip 82is suitably electrically connected to the conductor 72 by any suitablemethod as for example that describing in conjunction with FIG. 4 and tobe described in conjunction with FIGS. 12-15. The dished portion 80 ofthe fin 78 provides protection for the chip 82 and enhances the uniformheating of the chip 82 by the fin member 78.

Referring to FIG. 7, it is seen that an aperture 86 is formed in the fin78, through which is passed a thin upper portion of the mounting arm 76and the conductor 74. The fin 76 is heated and melted to form a head tosecurely fasten the fin 78 to the mounting arm 76. The conductor 74 isfolded over to be placed in close contact with the fin 78 and isconsiderably attached thereto, for example by soldering or through theuse of adhesives.

Referring now to FIG. 8, there is illustrated another modified form ofthe assembly of the present invention. Particularly, a base element 86is provided which maybe similar to that described in conjunction withthe description of base element 24. Within the base element is mounted aplastic support member 88 which is modified with a base member 90 and aplurality of pairs of arms 92 including an outer arm 94 and an inner arm96. As is best seen in FIG. 8, the pairs of support arms 94, 96 areadapted to rigidly support a generally square fin element 98, therebeing four pairs of arms 92, 100, 102 and 104.

As is best seen in FIGS. 9 and 10, there is molded between the inner andouter arms of each pair of arms 92, 102 a generally U-shaped conductiveelement 106, the conductive element being formed with a cross member 108and a pair of arms 110, 112. It will be noted from FIG. 9 that the arms110, 112 are generally tapered from the cross member 108 to the outerend of the arms 110, 112. It is to be noted that the U-shaped member 106is only provided between pairs of support arms 92 and 102. Prior toattaching the disc 98, an aperture 114 is drilled into the assembly toseparate the arm or the conductive member 112 from the conductive member110 for purpose to be seen from a further explanation of the assembly.

The molded base member 90 has embedded therein a pair of conductors 120,122 which are electrically connected to the conductive arms 110, 112respectively by any suitable means, as for example by soldering. Afterassembly of the disc 98 into place, the ends 124, 126 are heated andfolded over to form a rigid attachment of the disc 98 between the arms94, 96, the pair of arms 102 is illustrated in FIG. 9, and also betweenthe pairs of arms 100 and pairs of arms 104 as seen in FIG. 8. As bestseen in FIGS. 8 and 9, the disc 98 is provided with a centrally locatedsemiconductor chip 130 mounted on the bottom thereof, with a suitableconductor 132 interconnecting the semiconductor chip 130 with theconductive element 112. This connection to the semiconductor chip 130could be by any suitable means as for example that illustrated in FIG.4, 12, 13, 14, and 15. Of course, suitable insulating material must beprovided between the conductor 132 and the disc 98 to ensure that theconductor 132 is insulated from the disc 98. The disc 98 is caused tooverlap the upper end of the conductive arm 110 to ensure an electricalconnection to the conductive arm 110. Thus, the electrical circuitillustrated in FIG. 9 is from conductor 120, through conductor 110,through disc 98, chip 130, conductor 132, conductor 112, to conductor122.

FIG. 10 illustrates a method of connecting the disc 98 to the conductivemember 110 whereby the conductive member 110 is provided with a90-degree bend at the end thereof to be placed in electrical contactwith the disc 98. As described above, the upper end of arm 94 is heatedand folded over at end 136 to ensure a tight connection between theconductive member 110 and the disc 98.

Referring now to FIG. 11, it is illustrated a further modification ofthe fast response air temperature sensor of the present invention. Inthis modified version, a pair of fins 140, 142 are provided, the fins140, 142 being generally dished shaped with the apex of each dish facingthe other apex of the other dish. Sandwiched between the two fins 140,142 is a semiconductor chip 144 similar to that described in conjunctionwith the previous figures. As was the case previously, the discs 140,142 are suitably fastened to a thermal plastic member 146, the thermalplastic member 146 having a pair of arms 148, 150 into which are moldeda pair of conductors 152, 154. As is seen from FIG. 11, the conductor152 is folded over and suitably soldered to the upper face of fin 142and conductor 154 exits from the support arm 150 short of the endthereof and is directed toward the fin 140 and suitably solderedthereto. The upper ends of arms 148, 150 are heated and folded over toprovide a rigid attachment for the upper fin 142. While only two arms148, 150 have been shown, it is to be understood that molded element 146maybe provided with four arms of an identical configuration two arms148, 150 with the exception that no conductors will be molded within twoof the arms. As was described in the early part of the specification,the configuration of FIG. 11 provides a simple method of electricallyconnecting fins 140, 142 to the semiconductor chip 144. Also, theconfiguration of FIG. 11 does not require the delicate attachment of aconductive lead to the semiconductor chip as was previously described.

FIGS. 12-15 illustrate various other methods of attaching leads to thesemiconductor chip, particularly FIG. 12 illustrates the attachment of afine gold wire 160 from a conductor 162 molded in a support member 164,the wire being attached at the other end thereof to a semiconductor chip166. The chip 166 is attached to a fin member 168 as was describedabove. The electrical connection between the fin 168 and a secondconductor 170 is provided by folding over the end of conductor 170 andpositioning it in face-to-face relation with the fin 168.

FIG. 13 is a similar configuration to that described in conjunction withFIG. 12 with respect to the mounting of the fin 168 and itsinterconnection with the conductor 170. However, a conductor 172 isprovided which is molded into the other arm of support element 164 andfolded over at the end thereof to provide an open face for electricalattachment to another conductor. Again, the chip 166 is provided but isconnected to the conductor 172 through a conductor 176. The conductor176 is insulated from the fin 168 by means of insulating material 178sandwiched between the fin 168 and the conductor 176. A bridge isprovided between the conductor 176 and the chip 166 by means of a flapconductor 180 as is best illustrated in FIG. 14.

FIG. 15 illustrates a rather simple connection between a chip 182 and aconductor 184. Taking for example an attachment to the disc 168, asuitable layer of insulating material 186 is provided and the conductor184 is attached to the insulating material 186. The conductor 186 couldbe the conductor illustrated as conductor 172 in FIG. 13. The insulatingmaterial 186 could be built up to the level of the lower face of chip182 and the conductor 184 would merely pass across the insulatingmaterial 186 and the chip 182 in a straight line rather than the loopillustrated in FIG. 15.

FIGS. 16 and 17 illustrate a modified form of semiconductor chip whereinthe chip is provided with both output terminals on a single facethereof. For example, a chip 188 may have a pair of terminal projections190, 192 formed thereon, which projections are utilized to form theterminals for connection to the disc and external conductor associatedwith the chip. FIG. 17 illustrates this particular connection wherein adisc 194 is provided with a strip of insulating material 196 and aconductor 198. The chip 188 is then positioned as shown wherein theprojection 192 is an electrical contact with the fin 194 and theprojection 190 is in contact with the strip conductor 198. The stripconductor can then be connected to the chip associated support armsillustrated in FIGS. 3, 9 or 11.

FIG. 18 illustrates the invention as applied by thick film techniques.While thick film application is described, it is to be understood thatthin film techniques apply equally as well. Referring to the drawing,the fin 40 forms the substrate on which the various layers are depositedby the screening process. In carrying out the process, an insulatingstrip 200 is deposited on the fin 40 with an aperture 202 formed in thestrip 200 by either blocking the area of the aperture 202 with anemulsion or by etching the area of the aperture from the strip 200. Asemiconductor portion 204 is then deposited in the aperture 202 incontact with the fin 40. Finally a strip conductor 206 is deposited onthe portion 204 and on strip 200, and within the confines thereof, toform the conductive strip corresponding to strip 198 in FIG. 17, orconductor 53 in FIG. 2. In the thin film counterpart, the various layersare sputtered or evaporated with the necessary masking or etching toform the desired shapes.

A preferred form of the above described temperature sensor included abrass disc having a thickness of between 3 and 4 mils and a diameter ofapproximately 7/16 inch, and the response time of the sensor isapproximately one second for one hundred degrees change in temperature.The above dimensions provide a fin which is sufficiently stiff whilemaintaining the high surface area to mass ratio required to give thedesired fast response time.

Having described a preferred embodiment of the invention and severalmodifications thereof, it will be understood that the examples given areemployed in a descriptive sense only and not for purposes of limitation.Other embodiments and variations will be obvious to those skilled in theart and be made without departing from the spirit and scope of myinvention which is limited only by the appended claims.

I claim:
 1. A temperature sensor for sensing the temperature of a fluidcomprising a base member having at least first and second support armsthereon, fin means formed of a thin disc having a high surface area tomass ratio fixingly mounted on said first and second support armswhereby said fluid to be sensed may flow over the top and bottom surfaceof said fin means, a semiconductor chip having the characteristic ofchanging resistance with changes in temperature mounted on said finmeans, said semiconductor chip having a first and a second terminal on asingle surface of said chip, one of said terminals being in electricalcontact with said fin means, insulating means supported on said finmeans between an edge of said fin means and said chip, conductive meansmounted on said insulating means and within the confines thereof, theother of said terminals being in electrical contact with said conductivemeans, a first output conductor connected to said fin means, a secondoutput conductor electrically insulated from said fin means andelectrically connected to said conductive means.
 2. The sensor of claim1 wherein said first and second conductors are molded in said basemember, said first conductor being molded in said first support arm andsaid second conductor being molded in said second support arm, saidconductive means extending to the edge of said fin means.
 3. Theimprovement of claim 2 further including a relatively open cage meansfixingly mounted in surrounding relation with said fin means and saidsemiconductor chip.
 4. The improvement of claim 3 wherein said cagemeans is formed of plural wires each having a generally U-shape, saidwires being joined at the apex of said wires.
 5. The improvement ofclaim 1 wherein said terminals are formed as projections from saidsingle surface.